The result of its application is impressive
A group of US scientists have demonstrated a new cooling technology. According to them, its application has demonstrated the ability to get up to 740% more performance from the same microcircuits compared to traditional methods.
Specialists from the University of Illinois and the University of California at Berkeley covered the cooled surface with a layer of a special substance. They then added a conformal copper coating to it.
The experiment showed that it was this solution that allowed them to achieve the closest possible location of the surfaces of the cooled and cooling surfaces without the need to use heat-conducting materials. Including traditional thermal paste.
Right now, scientists have been able to achieve a 740% increase in the efficiency of the electrical circuit. But they are already announcing plans to improve the technology and use it in more complex devices.